HTG COPPER HYBRID POLISHING PAD 80X15 MM (TJ310)

HTG Copper Hybrid Polishing Pad 80X15 MM (TJ310) is a resin-bonded diamond pad used in the honing and polishing stages on concrete floors (80×15 mm).

It has a hybrid structure where metal and resin bonds are used together; used in the transition stage from metal diamond to resin; has a copper-infused bond structure.

HTG is the diamond brand for Xingyi floor grinders.

Starting from the lowest grit on a surface opened with metal diamond tooling, proceed sequentially so that each stage removes the scratches of the previous one.

Grit options and usage stage

• 50 grit — first resin stage to remove metal diamond scratches
• 100 grit — honing; makes the surface matte and smooth
• 200 grit — intermediate stage
• 400 grit — matte / semi-matte appearance
• 800 grit — semi-gloss appearance
• 1500 grit — glossy appearance